A rapid setting, quick drying smoothing compound for repair, filling and patching. It can be used on a variety of substrates to repair subfloor imperfections prior to the installation of most floor coverings. Priming is not required for most applications.
Tile and stone
New or old cement leveling compounds
Existing substrates with well-bonded, non water-soluble adhesive residues (including properly prepared cutback adhesive residues)
Concrete, masonry, wood, terrazzo, ceramic and quarry tile
Radiant floor heating systems
Very fine aggregates - trowel from a true feather edge up to 1/2"
Quick drying formula - floor coverings may be installed 15-20 minutes
Extremely smooth surface finish - maximum adhesive coverage
Versatile product - easily handles most substrate defi ciencies
CDPH Standard Method, v1.2. compliant (emission testing method for CA specification 01350)